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Flow visualization in a thin electronic system near the heat sink (u=0.75 m/s)

(a) fan flow measurement (b) straightened flow measurement

The effects of fan flow on the heat transfer characteristics in high-density packaging electronic equipment are investigated experimentally using the test model, which has some geometric features commonly found in thin electronic equipment, in order to improve the reliability of the cooling design.

Read more in Flow and Heat Transfer around Finned-Heat Sink in Electronic Enclosure with Axial Cooling Fan.

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